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No.205, Hongdu Office Building, Fanshen Road,ShenZhen,Guangdong,China China
Key Specifications/Special Features: Base material: polyamide and copper Foldaway space-saving and lightw
Key Specifications/Special Features: Base materials: 0.5oz Cu, 1mil PI and 1mil ADH Minimum hole size: di
Key Specifications/Special Features: Number of layers: 2 Flex CCL: 1.0 oz ED copper and 1.0 mil PI with *
Key Specifications/Special Features: Layers: 6 Surface finish: ENIG + OSP Board thickness: 1.0+/*0.1mm
*-layer Rigid-flex PCB 8 layer flex-rigid board *-layer Rigid-flex PCB Made of FR4 Key Specifications/Speci
Key Specifications/Special Features: Flexible PCB with hollowed-out structure Surface finish: plating tin
Key Specifications/Special Features: Base material: polyamide Materials and thickness: 1/2, 1, 2, 3 and 5
Key Specifications/Special Features: Five-layer FPC Base materials: Cu, PI and ADH Surface treatment: i
Key Specifications/Special Features: Number of layers: double-layer Silver or EMI shielding according to
Key Specifications/Special Features: Number of layer: single Base materials: 1oz Cu, 1mil pi and *5m ADH
Key Specifications/Special Features: Number of layers: two Flexible foldaway space saving Stiffener: FR
Key Specifications/Special Features: Production name: 4 layers HDI Board thickness: 0.7 0.1mm Layers:
Key Specifications/Special Features: Layers: 8 Surface finish: ENIG+OSP Board thickness: 1.*0.1mm Dimen
Key Specifications/Special Features: Layer number: 8 Surface finished: ENIG+OSP Board thickness: 0.8mm
Key Specifications/Special Features: Layer No.: 8 Surface finished: ENIG + OSP Board thickness: 1.0mm A
Key Specifications/Special Features: Layers: 4 Surface finish: EING Board thickness: 1.0+/*0.1mm Dimens
Key Specifications/Special Features: Layers:8L Surface finish: ENIG+OSP Board thickness: 0.9+/*0.*1mm D
Key Specifications/Special Features: *-layer copper filling HDI Internal number: HE*8N****0 Plating:
Key Specifications/Special Features: Eight-layers copper filling HDI Plating: copper filling Board thick
Key Specifications/Special Features: Technical parameter: Board thickness: 1.0 0.1mm Layers: *0 layers
連絡先担当者 Mr. Huang YatSen
住所 No.205, Hongdu Office Building, Fanshen Road, ShenZhen, Guangdong
We will contact you soon .
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