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連絡先担当者 Mr. Huang
No.205, Hongdu Office Building, Fanshen Road, ShenZhen, Guangdong
Key Specifications/Special Features: *-layer copper filling HDI â…¡ Internal number: HE*8N****0 Plating: copper filling Board thickness: 1.0 ± 0.1mm Dimple: ï&frac*4;œ*0um Registration to layer: ï&frac*4;œ*0 um Line/space: 4/4 mil Micro-via: **0um Surface finish: ENIG and OSP Material: EM**5 Tg: **0℃
