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連絡先担当者 Mr. Huang
No.205, Hongdu Office Building, Fanshen Road, ShenZhen, Guangdong
Key Specifications/Special Features: Eight-layers copper filling HDI Plating: copper filling Board thickness: 1.0±0.1mm Dimple: *0um Registration to layer: *0um Line/space: 4/4mils Micro-Via: **0um Surface finish: ENIG + OSP Material: EM**5 TG **0
