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Multilayer PCBs with Immersion Gold

Multilayer PCBs with Immersion Gold

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今すぐお問い合わせください
無料会員

連絡先担当者 jessie

Add.:3F,Block B1,HengFeng Ind.Zone,Hezhou,Xixiang,BaoAn,Shenzhen, Guangdong, 518128, P.R.China, Shenzhen, Guangdong

今すぐお問い合わせください

Description

  • Specifications:
    • Base material: PTFE, PCB, FR4
    • Layer count: 4layer board
    • Board thickness: 1.6mm
    • Copper thickness: 1oz
    • Surface finishing: ENIG
    • Solder mask color: green
    •  
  • Available specifications:
    • Base materials: FR4, aluminum, FPC and copper
    • Copper thickness: 0.5oz (minimum)
    • Copper thickness: 4oz (minimum)
    • Board thickness: 0.2mm (minimum)
    • Board thickness: 3.2mm (maximum)
    • Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
    • Possible solder mask colors: green, black, white, yellow, blue, red and more
    • Board dimensions: **0 x 1,**0mm
    • Hole diameter: 0.2mm (minimum)
    • Line width: 0.**5mm (minimum)
    • Line spacing: 0.**5mm (minimum)
    • SMT pitch: *0° (minimum)
    • Annular ring: 0.*5mm (minimum)
    • Aspect ratio: *1:*1
    •  
  • Surface/hole plating tolerance:
    • Hole tolerance (PTH): 0.*5mm
    • Hole tolerance (NPTH): 0.*5mm
    • SM tolerance (LPI): dimensions
    •  
  • Electrically test: supported
  • RoHS Directive-compliant
  • Possibility of SMT device mounting: supported
  •  

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jessie < Cirket Electronics Company >

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