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4 layer high-density multilayer PCBs with immersion gold

4 layer high-density multilayer PCBs with immersion gold

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今すぐお問い合わせください
無料会員

連絡先担当者 jessie

Add.:3F,Block B1,HengFeng Ind.Zone,Hezhou,Xixiang,BaoAn,Shenzhen, Guangdong, 518128, P.R.China, Shenzhen, Guangdong

今すぐお問い合わせください

Description

  • Specifications:
Base material: FR4, PCB,
Layer count: 4 layer board
Board thickness: 1.6mm
Copper thickness: 1oz
Surface finishing: immersion gold
Soldermask color: green
  • Available specifications:
Base materials: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: **0 x 1,**0mm
Hole diameter: 0.2mm (minimum)
Line width: 0.**5mm (minimum)
Line spacing: 0.**5mm (minimum)
SMT pitch: *0° (minimum)
Annular ring: 0.*5mm (minimum)
Aspect ratio: *1:*1
  • Surface/hole plating tolerance:
Hole tolerance (PTH): 0.*5mm
Hole tolerance (NPTH): 0.*5mm
SM tolerance (LPI): Dimension
  • Electrically test: supported
  • RoHS Directive-compliant
  • Possibility of SMT device mounting: supported

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jessie < Cirket Electronics Company >

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