Cathay Advanced Materials Limited

Supply sputtering target (Metal, Oxide, Alloy, Boride, Carbide, Nitride, Fluoride, Silicide, Sulfide), high purity Rare Earth and Lanthanum Hexaboride (LaB6). 1.) Oxide sputtering target: La2O3, CeO2, Nd2O3, Sm2O3, Eu2O3, Gd2O3, Tb4O7, Dy2O3, Ho2O3, Er2O3, Tm2O3, Yb2O3, Lu2O3, Sc2O3, Y2O3, Ta2O5, Nb2O5, Ga2O3, V2O5, ZrO2 doped with Ti, WO3, HfO2, MgO, Al2O3, Indium Tin Oxide, ITO (In2O*-SnO2), ZnO, Al2O3 doped ZnO (AZO), Ga2O3 doped ZnO (GZO), La0.*7Sr0.*3MnO3 (LSMO), ZrO*-Y2O3 stabilized (YSZ), ZrO2+Ti, ZrO2+SiO2, Bi2O3, Cr2O3, MoO, MoO3, NiO, SiO, Cr-SiO, SiO2, TiO, TiO2, TiO*-Nb2O5, Ti2O3, Ti3O5, CuO/Al2O3, Sb2O3, BaO, BaTiO3, CaO, Fe2O3, Fe3O4, PbO, PbTiO3, PbZrO3, LiNbO3, SrO, SrTiO3, SrZrO3, SrBaTiO3, PZT (Plumbum Zirconate Titanate), SrRuO3, LaNiO3, InGaZnO, CuInO2. 2.) (Boride, Carbide, Nitride, Fluoride, Silicide, Sulfide) sputtering target LaB6, ZrB2, CrB2, TiB2, HfB2, Mo2B5, TaB2, NbB2, W2B, WB, VB2 TiC, SiC, WC, WC-Co, B4C, TaC, ZrC, Cr3C2, HfC, Mo2C, VC Si3N4, AlN, BN, BN/SiC mixture, HfN, TaN, NbN, ZrN, TiN, VN CoSi2, Mo5Si3, MoSi2, Ta5Si3, TaSi2, Nb5Si3, NbSi2, CrSi2, Cr3Si, HfSi2, TiSi2, Ti5Si3, ZrSi2, WSi2, VSi2, V3Si, NiSi, 3.) Metal sputtering target: Silver, Ag, Platinum, Pt, Palladium, Pd, Iridium, Ir, Ruthenium, Ru, Rhenium, Re, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, Y, Silicon, Si, Zinc, Zn, Chromium, Cr, Cobalt, Co, Aluminum, Al, Nickel, Ni, Titanium, Ti, Tungsten, W, Molybdenum, Mo, Tantalum, Ta, Zirconium, Zr, Hafnium, Hf, Vanadium, V, Germanium, Ge 4.) LaB6 powder, LaB6 disc, LaB6 tablet, LaB6 target, LaB6 rod, LaB6 crucible, LaB6 sector ring, LaB6 tube (hollow cathode), GdB6 rod 5.) Lanthanum, Cerium, Praseodymium, Neodymium, Samarium, Europium, Gadolinium, Terbium, Dysprosium, Holmium, Erbium,Thulium, Ytterbium, Lutetium, Scandium, Yttrium in metal, alloy, oxide, chloride, hydrate, sulphate, sulfide, acetate, oxalate, carbonate, fluoride, nitrate, nitride.