Shenzhen Sinbond Electronic Materials Co., Ltd

Adhesive for chip mounting machines SND series(ºƒ) We developed €SND series €adhesive for chip mounting machines or SMD.They are one-part thermo-setting epoxy adhesive with the property of preservation stability, and are of 1 to 2 minute short time or high speed curability required for **0 to **0„ƒ heat-give SMD packaging.We are ready, in addition, to offer the adhesive of various grades with excellent micro-printability or with suitability for high-speed dispensers. Packaging:**0gr、**0gr, *0cc, *0cc, *0ccsyringes, ***0g is standard bottled Underfill Halogen-free High-Lead(Pb) Die-Attach Solder Pasteˆ«˜“…”¡†‰ High lead, high melting point alloys, lead content is more than *5%. Can meet the RoHS directive. Usually used in package of power semiconductor device, can Miscibility with Au, Cu, AG, high residual impedance and good welding strength. The halogen-related failure mode for die-attach solder pastes is the corrosion of wirebond pads on the topside of Power Semiconductor die which are soldered to the leadframe with halogen-containing solder paste. Packaging: *5g is *0CC syringes, **0g is *0CC syringes, **0g is standard bottled, ***0g is bottled or syringes