タイトルまたは説明

Electronic Potting two Compound silicone Feature

 
HY ***5 is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of  PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.

 

Electronic Potting two Compound silicone Typical Application

HY ***5 could be applied to

- high powered electronics, 

- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.

-It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.

 

Electronic Potting two Compound silicone TECHNICAL GUIDELINES

1, Pls put part A and part B in separate container and stir evenly before mixing the two part together.

2, Mixing Ratio: part A: part B = 1:1

3, Deaeration the mixture in vacuum pump under 0.*8 MPa for **5 minutes.Then the mixture could be used for pouring.

4, Pls note that the thickness of the silicone affects the curing time. If the silicone used is a little thick,then the curing time will be a little longer.The temperature also affects the curing time.When in lower temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. With temperature of *0~**0°C, the silicone will cure in *5 minutes; while in *5°C room temperature, the silicone will cure around 8 hours.