タイトルまたは説明

Features & Applications Addition  liquid encapsulant and potting silicone  

HY***1 is addition liquid encapsulant potting silicone in two parts with low viscosity. It can be cured completely at room temperature. HY ***1  works on the surface of material as PC(Poly-carbonate),PP,ABS,PVC as to its superior bonding feature. It is also applicable for insulation, waterproof and bonding of electronics parts. It meets the requirements of European RoHS.

 Addition  liquid encapsulant and potting silicone Typical Application

- Potting for Protetion of general electronic Module.   
- Outdoor protection for LED screen.   

Addition liquid encapsulant and potting silicone TECHNICAL GUIDELINES  

1, Please put part A and part B in separate container and stir evenly before mixing the two parts together.
2, Weight Ratio: part A: part B = *0:1
3, Bubble release if necessary. Deaeration the mixture under 0.*8 MPa for 3 minutes. 4,HY ***1 is cured at room temperature, so pls put it under room temperature after pouring.It comes to next process when basically cured, and it takes about *4 hours for completely cured.  Kindly note: Temperature and Humidity with a tremendous influences for curing of HY ***1.     


  For get further information about our silicone product, PLS contact with Miss Rose:
Tel: ***6 - **5 - *******4
Fax: ***6 - **5 - *******0
Mob: ***************5
skype: LuoYan***2
Email: hyjz(at)szrl(dot)net