タイトルまたは説明

BERGQUIST BOND-PLY TBP **0P Formerly known as BOND-PLY **0P

Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape

BERGQUIST BOND-PLY TBP **0P is a thermally conductive, electrically insulating, double-sided pressure

sensitive adhesive tape. The tape consists of a high performance, thermally conductive acrylic adhesive coated

on both sides of a polyimide film. Use BERGQUIST BOND-PLY TBP **0P in applications to replace mechanical

fasteners or screws.

BERGQUIST BOND-PLY **0P Typical Applications Include:

• Heat sink onto BGA graphic processor

• Heat sink onto drive processor

• Heat spreader onto power

converter PCB

• Heat spreader onto motor control PCB

BERGQUIST BP**0P Configurations Available:

• Roll form and die-cut parts

The material as delivered will

include a continuous base liner with

differential release properties to allow

for simplicity in roll packaging and

application assembly.