タイトルまたは説明

BERGQUIST  GAP PAD  TGP HC***0 Formerly known as GAP PAD  HC 5.0

Highly Conformable, Thermally Conductive, Low-Modulus Material

BERGQUIST  GAP PAD  HC5.0 is a soft and compliant gap filling material

with a thermal conductivity of 5.0 W/m-K.The material offers exceptional thermal

performance at low pressures due to a unique filler package and low-modulus resin

formulation. The enhanced material is ideal for applications requiring low stress on

components and boards during assembly.BERGQUIST  GPHC5.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

BERGQUIST  GAP PAD  TGP HC***0 is offered with natural inherent tack on both

sides of the material, eliminating the need for thermally-impeding adhesive layers.

The top side has minimal tack for ease of handling. BERGQUIST  GAP PAD  TGP

HC***0 is supplied with protective liners on both sides.