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Shenzhen,Guangdong,China China
BERGQUIST BOND-PLY TBP 400P Formerly known as BOND-PLY 660P Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape BERGQUIST BOND-P
BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electrically conductive SIL PAD rubber. The materi
BERGQUIST GAP FILLER TGF 3600 Known as BERGQUIST GAP FILLER 3500S35 BERGQUIST GAP FILLER TGF 3600 is the technology leader in thermally conductive, l
BERGQUIST BP108 BOND-PLY 100 BOND-PLY TBP 850 BERGQUIST BOND-PLY 100 Configurations Available: Sheet form, roll form and die-cut parts Shelf Life:
BERGQUIST GAP PAD TGP HC5000 Formerly known as GAP PAD HC 5.0 Highly Conformable, Thermally Conductive, Low-Modulus Material BERGQUIST GAP PAD HC5.0
連絡先担当者 Carrie Null
住所 Shenzhen, Guangdong
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