タイトルまたは説明

BERGQUIST GAP FILLER TGF ***0 is a two-part, high performance, thermally

conductive, liquid gap-filling material, which features exceptional slump resistance and 

high shear thinning characteristics for optimized consistency and control during dispensing. 

The mixed system will cure at room temperature and can be accelerated with the

addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness 

variations with little  or no stress to the sensitive components  during assembly. BERGQUIST

 GF***0  exhibits low level natural tack characteristics and is intended for use in applications 

where a strong structural bond is not required. As cured,BERGQUIST Gap Filler ***0 (Two-Part)

provides a soft, thermally conductive,form-in-place elastomer that is ideal for fragile assemblies

 and filling unique and intricate air voids and gaps.

BERGQUIST GF***0  Typical Applications Include:

• Automotive electronics

• Computers and peripherals

• Between any heat generating semiconductor and a heat sink

• Telecommunications

Configurations Available:

• Supplied in cartridge or kit form

• With or without glass beads