离岸价格
Get Latest Price1 ~ 2 / Sheet
|5 Sheet Minimum Order
国:
China
モデル番号:
GPHC3.0
离岸价格:
1 ~ 2 / Sheet Get Latest Price
ロケーション:
USA
最低注文量の価格:
1 per Sheet
最低注文量:
5 Sheet
パッケージの詳細:
box
納期:
-
供給能力:
100 Sheet per Week
支払いタイプ:
T/T
製品グループ :
連絡先担当者 Carrie
Shenzhen, Guangdong
BERGQUIST GPHC3.0,GAP PAD HC 3.0,GAP PAD TGP HC***0
BERGQUIST GAP PAD TGP HC***0 is a soft and compliant gap filling material with a thermal conductivity
of 3.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K
filler package and lowmodulus resin formulation. The enhanced material is ideal for applications requiring
low stress on components and boards during assembly. BERGQUIST GPHC3.0 maintains a conformable
nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness
and/or topography.
BERGQUIST GAP PAD HC 3.0 Typical Applications Include:
• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks
Configurations Available:
• Sheet form and die-cut parts
For more product information, please feel free to contact us
| 国: | China |
| モデル番号: | GPHC3.0 |
| 离岸价格: | 1 ~ 2 / Sheet Get Latest Price |
| ロケーション: | USA |
| 最低注文量の価格: | 1 per Sheet |
| 最低注文量: | 5 Sheet |
| パッケージの詳細: | box |
| 納期: | - |
| 供給能力: | 100 Sheet per Week |
| 支払いタイプ: | T/T |
| 製品グループ : | GAP PAD SERIES |
