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Shenzhen,Guangdong,China China
BERGQUIST GPHC3.0, GAP PAD HC 3.0, GAP PAD TGP HC3000 BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conduc
BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. SIL PAD T
ERGQUIST SIL PAD TSP PPK900, Polyester-Based, Thermally Conductive Insulation Material BERGQUIST SIL PAD TSP PPK900 Known as BERGQUIST POLY-PAD K-4 BE
BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling Pad GAP PAD TGP 1000VOUS, Silicone Thermal Pad For Converter GAP PAD VO Ultra SoftInt
BERGQUIST GAP FILLER TGF 1500 is a two-part, high performance, thermally conductive, liquid gap-filling material, which features exceptional slump res
連絡先担当者 Carrie Null
住所 Shenzhen, Guangdong
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