TE28F320C3TD70

タイトルまたは説明

Product Features

â– Flexible SmartVoltage Technology

—2.7 V– 3.6 V Read/Program/Erase

—*2 V for Fast Production Programming

â– 1.*5 V–2.5 V or 2.7 V–3.6 V I/O Option

—Reduces Overall System Power

â– High Performance

—2.7 V– 3.6 V: *0 ns Max Access Time

â– Optimized Architecture for Code Plus

Data Storage

—Eight 4 Kword Blocks, Top or Bottom

Parameter Boot

—Up to One Hundred-Twenty-Seven *2

Kword Blocks

—Fast Program Suspend Capability

—Fast Erase Suspend Capability

â– Flexible Block Locking

—Lock/Unlock Any Block

—Full Protection on Power-Up

—WP# Pin for Hardware Block Protection

â– Low Power Consumption

—9 mA Typical Read

—7 A Typical Standby with Automatic

Power Savings Feature (APS)

â– Extended Temperature Operation

—–*0 °Cto**5 °C

â– ***-bit Protection Register

—*4 bit Unique Device Identifier

—*4 bit User Programmable OTP Cells

â– Extended Cycling Capability

—Minimum **0,**0 Block Erase Cycles

â– Software

—Intel

® Flash Data Integrator (FDI)

—Supports Top or Bottom Boot Storage,

Streaming Data (e.g., voice)

—Intel Basic Command Set

—Common Flash Interface (CFI)

â– Standard SurfaceMount Packaging

—**-Ball µBGA*/VFBGA

—**-Ball Easy BGA Packages

—**-Lead TSOP Package

â– ETOX™VIII (0.*3 µm) Flash

Technology

—*6, *2 Mbit

â– ***-bit Protection Register

—*4 bit Unique Device Identifier

—*4 bit User Programmable OTP Cells

â– Extended Cycling Capability

—Minimum **0,**0 Block Erase Cycles

â– Software

—Intel

® Flash Data Integrator (FDI)

—Supports Top or Bottom Boot Storage,

Streaming Data (e.g., voice)

—Intel Basic Command Set

—Common Flash Interface (CFI)

â– Standard SurfaceMount Packaging

—**-Ball µBGA*/VFBGA

—**-Ball Easy BGA Packages

—**-Lead TSOP Package

â– ETOX™VIII (0.*3 µm) Flash

Technology

—*6, *2 Mbit