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Shenzhen Hengtaida Technology Co, .Ltd

Fuyong,Shenzhen,Guangdong,China China

無料会員
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ホーム 会社 Shenzhen Hengtaida Technology Co, .Ltd 「売ります」情報

連絡先担当者 Mr. peter shi

住所 Fuyong, Shenzhen, Guangdong

今すぐお問い合わせください この会社を評価 詐欺/迷惑メールの苦情
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「売ります」情報: 13

Printed Circuit Board-LCD
Printed Circuit Board-LCD

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 4 layers Sur

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PCB-3
PCB-3

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 1-18 layers

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PCB Thickness 3.0
PCB Thickness 3.0

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 3.0 mm Layer Count: 6 layers Sur

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PCB-1
PCB-1

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 1-18 layers

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Printed Circuit Board
Printed Circuit Board

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 1-18 layers

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Printed Circuit Board-1
Printed Circuit Board-1

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 1-18 layers

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Printed Circuit Board-2
Printed Circuit Board-2

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 1-18 layers

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Printed Circuit Board-4
Printed Circuit Board-4

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 1-18 layers

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Printed Circuit Board- with BGA
Printed Circuit Board- With BGA

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 4 layers Sur

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PCB-2
PCB-2

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 1-18 layers

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Printed Circuit Board-3
Printed Circuit Board-3

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 1-18 layers

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Printed Circuit Board-9
Printed Circuit Board-9

Rigid PCB Specifications: Basis Material: FR4 / Tg170 Board Thickness: 1.6 mm Layer Count: 1-18 layers

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Printed Circuit Board-Tin
Printed Circuit Board-Tin

Rigid PCB Specifications: Basis Material: FR4 Board Thickness: 1.6 mm Layer Count: 4 layers Surface Fi

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    Mr. peter < Shenzhen Hengtaida Technology Co, .Ltd >
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